Absolute Pressure Sensor Die XGZP0703

  • Ranges: 0kPa~100kPa…2000kPa(0psi~15psi…300psi)
  • Piezoresistive MEMS Technology
  • Silicon-Silicon,Solid state,High reliability
  • Absolute Pressure, Excited by voltage or current
  • Miniature size,Cost effective
Description

APPLICATIONS

  • For Automotive electronics field, such as tire pressure gauge, MAP sensor etc.
  • For Air compressor,household electrical appliances etc.
  • For Water pump,fire controlling,diving,other fields,dam engineering,switch etc.
  • For Pressure gauges,instruments and meters, and medical field etc.

 

INTRODUCTION

XGZP0703 series pressure sensor chip is a miniature silicon piezoresistive sensor die that is designed and fabricated by MEMS technology on six inch silicon wafers in a class 100 clean room. The pressure sensing chip is composed of a springy diaphragm and four resistors integrated in the diaphragm. Four piezo-resistors form a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge will output linear millivolt voltage that is proportional to input pressure.

Chip size is 0.7×0.7×0.3 mm for silicon bonding with silicon, which provide state-of-the-art performance in a leading small size for oil-filling or isolated-diaphragm sensor.

With good repeatability, linearity, stability and sensibility, XGZP0703 absolute pressure sensor die is also easy for users to calibrate output, thermal drift and make temperature compensation by using operational amplifier or integrated circuit.

 

DIMENSION (Unit:mm)

absolute pressure sensor die xgzp0703 dimension

 

ORDER GUIDE

absolute pressure sensor die xgzp0703 order guide

 

Datasheet: XGZP0703 Pressure Sensor Die V1.4.PDF

SAFETY NOTES & WARRANTY

SAFETY NOTES

Using these sensors products may malfunction due to external interference and surges, therefore, please confirm the performance and quality in actual use. Just in case, please make a safety design on the device (fuse, circuit breaker, such as the installation of protection circuits, multiple devices, etc.), so it would not harm life, body, property, etc even a malfunction occurs. To prevent injuries and accidents, please be sure to observe the following items:

  • The driving current and voltage should be used below the rated value.
  • Please follow the terminal connection diagram for wiring. Especially for the reverse connection of the power supply, it will cause an accident due to circuit damage such as heat, smoke, fire, etc.
  • In order to ensure safety, especially for important uses, please be sure to consider double safety circuit configuration.
  • Do not apply pressure above the maximum applied pressure. In addition, please be careful not to mix foreign matter into the pressure medium. Otherwise, the sensor will be discarded, or the media will blew out and cause an accident.
  • Be careful when fixing the product and connecting the pressure inlet. Otherwise, accidents may occur due to sensor scattering and the blowing out of the media.
  • If the sensor come with sharp PIN, please be careful not to hurt your body when using it.

WARRANTY

The information in this sheet has been carefully reviewed and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Furthermore, this information does not convey to the purchaser of such devices any license under the patent rights to the manufacturer. CFSensor reserves the right to make changes without further notice to any product herein.

CFSensor makes no warranty, representation or guarantee regarding the suitability of its product for any particular purpose, nor does CFSensor assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters can and do vary in different applications. All operating parameters must be validated for each customer application by customer’s technical experts. CFSensor does not convey any license under its patent rights nor the rights of others.

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